Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging

Sintering of nano Ag paste on bare Cu has attracted more interests recently for high-temperature electronics packaging, which offers the advantages high reliability, cost-effective and direct bonding process. However, current methods normally need a protective atmosphere or metallization substrate to avoid oxidation. In this study, self-assembled monolayers (SAMs) were deposited suppress oxidation prior sintering. Thermal-compression process Cu/nano Ag/Cu joints was conducted analysed with without SAMs treatment. The cross-sectional characterization shear tests evaluate influence When applied, strength 12.72 MPa been achieved in ambient atmosphere, is much higher than value treatment (3.77 MPa). It identified that mode changed from interfaces sintered inside due applied SAMs. This technological approach provides tangible method packaging.